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 Freescale Semiconductor Technical Data
Document Number: MC33199 Rev. 4.0, 10/2006
Automotive ISO 9141 Serial Link Driver
The MC33199 is a serial interface circuit used in diagnostic applications. It is the interface between the microcontroller and the special K and L lines of the ISO diagnostic port. The MC33199 has been designed to meet the Diagnosis System ISO9141 specification. The device has a bi-directional bus K line driver, fully protected against short circuits and over temperature. It also includes the L line receiver, used during the wake up sequence in the ISO transmission. The MC33199 has a unique feature which allow transmission Baud rate up to 200kBaud. Features * Electrically Compatible with Specification "Diagnosis System ISO9141" * Transmission speed up to 200kBaud * Internal Voltage Reference Generator for Line Comparator Thresholds * TXD, RXD and LO pins are 5V CMOS Compatible * High Current Capability of DIA pin (K line) * Short Circuit Protection for the K Line Input * Over Temperature Shutdown with Hysteresis * Large Operating Range of Driver Supply Voltage * Large Operating Temperature Range * ESD Protected pins * Pb-Free Packaging Designated by Suffix Code EF
33199
LIN, ISO-9141 J-1850 PHYSICAL INTERFACES
D SUFFIX EF SUFFIX (PB-FREE) PLASTIC PACKAGE 98ASB42565B 14 PIN SOIC
ORDERING INFORMATION
Device MC33199D MCZ33199EF/R2 Temperature Range (TA) -40C to 125C Package
14 SOIC
VBAT VDD
33199
VDD VCC VS
MCU
I/O
LO RXD TXD
L I1 DIA
ISO L-LINE
SCIRXD SCITXD
(BUS) ISO K-LINE
GND
Figure 1. Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products.
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VCC
33199
VS
REF-OUT LO
Reference Generator
Protection
C2
+ -
L
I1 Source
REF-IN-L REF-IN-K RXD
VCC C1
I1
- +
Thermal Shutdown
DIA
TXD
Driver Current Limit
GND
Figure 2. 33199 Simplified Internal Block Diagram
33199
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Analog Integrated Circuit Device Data Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
33199
VCC REF-IN-L REF-IN-K LO RXD TXD NC 1 2 3 4 5 6 7 14 13 12 11 10 9 8 REF-OUT VS L I1 GND DIA NC
Figure 3. 33199 Pin Connections
Table 1. Pin Definitions A functional description of each pin can be found in the Functional Pin Description section, beginning on page 12.
Pin Number 1 2 3 4 5 Pin Name VCC REF-IN-L REF-IN-K LO RXD Definition 5V typical power supply pin. typical supply current is less than 1.5mA Input reference for C2 comparator. Input reference for C1 comparator. This pin control Sleep Mode, Transmit Level, and Speed. It has a weak pulldown. Open drain output of the data on BUS. A recessive bus = a logic [1], a dominant bus = logic [0]. An external pullup is required. Data input here will appear on the BUS pin. A logic [0] will assert the bus, a logic [1] will make the bus go to the recessive state. No internal connection to these pins. Provides a battery-level logic signal. Electrical Common Ground and Heat removal. A good thermal path will also reduce the die temperature. Power input. An external diode is needed for reverse battery protection. The external bus load resistor connects here to prevent bus pullup in the event of loss of module ground. This pin connects to the bus through external components. Internal reference voltage generator output pin.
6
TXD
7, 8 9 10
NC DIA GND
11 12
I1 L
13 14
VS REF-OUT
33199
Analog Integrated Circuit Device Data Freescale Semiconductor
3
ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.
Ratings ELECTRICAL RATINGS (1) VS Supply Pin DC Voltage Range Transient Pulse (2) VCC Supply DC Voltage Range DIA and L Pins
(2)
Symbol
Value
Unit
V VS VPULSE VCC 0.5 to + 40 2 to + 40 0.3 to + 6.0 V
DC Voltage Range Transient Pulse (clamped by internal diode) DC Source Current DIA Low Level Sink Current TXD DC Voltage Range REF-IN DC Voltage Range VS < VCC VS > VCC ESD Voltage Capability THERMAL RATINGS Storage Temperature Operating Junction Temperature Thermal Resistance, Junction to air Max Power Dissipation (@ TA=105 C) Peak Package Reflow Temperature During Reflow
(3), (4)
- 0.5 TO + 38 -2 - 50 INT. LIMIT -0.3 TO VCC +0.3 -0.3 TO VCC -0.3 TO VS VESD +/-2000
V V mA mA V V
V
TSTG TJ RTJA PD TPPRT
55 to + 150 40 to + 150 180 250 Note 4.
C C C/W mW C
Notes 1. The device is compatible with Specification: "Diagnosis System ISO9141" 2. See the test Circuit (Figure 26). Transient test pulse according to ISO76371 and DIN 40839, highest test levels 3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 4. Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33199
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Analog Integrated Circuit Device Data Freescale Semiconductor
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics Characteristics noted under conditions VCC from 4.5V to 5.5V, VS from 4.5V to 20V unless otherwise note. Typical values reflect approximate mean at 25C, nominal VCC and VS, at time of device characterization. Typical values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted.
Characteristic VCC PIN 1 VCC Supply Voltage Range VCC Supply Current
(6)
Symbol
Min
Typ
Max
Unit
VCC ICC
4.5 0.5 1.0
5.5 1.5
V
V
REF-IN-L PIN 2 AND REF-IN-K PIN 3 REF-IN-L & REF-IN-K Input Voltage Range: for 0 Notes 5. Measured with TXD=Vcc, I1=Vs, DIA & L high, no load, REF-IN-L and REF-IN-K connected to REF-OUT
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Analog Integrated Circuit Device Data Freescale Semiconductor
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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions VCC from 4.5V to 5.5V, VS from 4.5V to 20V unless otherwise note. Typical values reflect approximate mean at 25C, nominal VCC and VS, at time of device characterization. Typical values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted.
Characteristic L INPUT PIN 12 High Level Input Threshold Voltage (REF-IN-L connected to REF-OUT) Low Level Input Threshold Voltage (REF-IN-L connected to REF-OUT) Input Hysteresis Leakage Current L1 INPUT PIN 11 Static Source Current Static Saturation Voltage @ I1S=-2mA Dynamic Source Current Dynamic Saturation Voltage @ I1S=-40mA VS PIN 13 VS Supply Voltage Range VS Supply Current REF-OUT PIN 14 Output Voltage : @ 3 < VS < 5.6V & IRO = +-10 @ 5.6 < VS < 18V & IRO = +-10 @ 18 < VS < 40V & IRO = +-10 Maximum output current Pull-up resistor to VCC 6. IOUT RPU VREF 2.7 0.5 x VS 8.5 -50 3.0 8.0 3.3 0.56 x VS 10.8 50 12 k V VS IS 4.5 0.5 1.3 20 2.0 V mA I1S VI1SAT I1D VI1DSAT -4.0 VS - 1.2 -120 VS - 2.7 -3.0 VS - 0.8 -80 VS - 0.85 -2.0 VS -40 VS mA V mA V VHYST ILEAK VIL VIH VREF MIN 0.25V VREF MIN -0.2V 300 4.0 VREF 0.325V VREF -0.125V 450 10 VREF MAX 0.4V VREF MAX -0.05V 600 16 mV V V Symbol Min Typ Max Unit
Measured with TXD=VCC, I1=VS, DIA & L high, no load, REF-IN-L and REF-IN-K connected to REF-OUT
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Analog Integrated Circuit Device Data Freescale Semiconductor
ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions Vcc from 4.5V to 5.5V, Vs from 4.5V to 20V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted.
Characteristic DELAY TIMING Transmission Speed High or Low Bit Time Rxd Output : Low to High Transition Delay Time High to Low Transition Delay Time LO Output : Low to High Transition Delay Time High to Low Transition Delay Time DIA Output : Low to High Transition Delay Time High to Low Transition Delay Time I1 Output @ VS-I1 > 2.7V : Rise time Hold Time tI1R tI1F 1.5 0.3 4.5 tDDR tDDF 650 650 s tLDR tLDF 2.0 2.0 ns tRDR tDRF 450 450 s 1/T BIT T BIT 0.0 5.0 200k Baud s ns Symbol Min Typ Max Unit
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Analog Integrated Circuit Device Data Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS
TIMING DIAGRAMS
+5V
+12V
5V tBIT TXD Input Signal
VCC VBAT I1 REF-OUT REF-IN-L Input Signal REF-IN-K TxD DIA 1nF GND Test Point
0V tDDR 10V DIA Output Signal 2V tDDF
Figure 4. TXD to DIA AC Characteristic
+5V
+12V
12V tBIT DIA and L Input Signal tRDF / tLDF
2K
VCC VBAT REF-OUT REF-IN-L REF-IN-K TXD DIA GND L Input Signal
0V tRDR / tLDR 4.5V 0.4V
Test Points 2x30pF
LO RXD
RXD ot LO Output Signal
Figure 5. DIA to TxD and L to LO AC Characteristics
.
tBIT 5V TXD Signal tI1F tI1H 120mA Current Source I1 Maximum Limit 0V
Typical I1 Waveform 40mA
4mA 2mA tI1R Current Source I1 Minimum Limit
Figure 6. Current Source I1 AC Characteristics At static HIGH or LOW level TXD, the current source I1 delivers a current of 3mA (typ). Only during LOW to HIGH transition, does this current increase to a higher value in order to charge the K Line capacitor (Cl<4nF) in a short time.
33199
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Analog Integrated Circuit Device Data Freescale Semiconductor
ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES
+5V
+12V
I1 pulse current
VCC VBAT I1 REF-OUT Input Signal REF-IN-L REF-IN-K DIA TXD LO RXD GND 33nF 10 DIA discharge current To Oscilloscope
Figure 7. Current Source I1 and DIA Discharge current test schematic
ELECTRICAL PERFORMANCE CURVES
Figure 10. IS Supply Voltage versus VS Supply Voltage Figure 8. ICC Supply Current versus Temperature
-40C 25C 125C
Figure 9. VS Supply Current versus VS Supply Voltage
Figure 11. VS Voltage versus IS Current (VCC=5.5V, VDIA, L, I1=20V
33199
Analog Integrated Circuit Device Data Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES
Figure 12. REF-OUT Voltage versus VS Supply Voltage
Figure 15. L and DIA Current versus L and DIA Voltage
I DIA = 40mA
Figure 13. REF-OUT Voltage versus REF-OUT Current
Figure 16. DIA Saturation Voltage versus Temperature
Figure 14. L and DIA Hysteresis versus Temperature
Figure 17. DIA Current Limit versus Temperature
33199
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Analog Integrated Circuit Device Data Freescale Semiconductor
ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES
Figure 18. RXD Pull-up Resistor versus Temperature
Figure 21. I1 Output DC Current versus Temperature
LO RXD
Figure 19. TXD and LO Saturation Voltage versus Temperature
Figure 22. I1 Output Pulse Current versus VS Supply Voltage
I=40mA I=2mA
Figure 20. I1 Saturation Voltage versus Temperature
Figure 23. I1 Pulse Current Width versus Temperature
33199
Analog Integrated Circuit Device Data Freescale Semiconductor
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FUNCTIONAL DESCRIPTION INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The MC33199 is a serial interface circuit used in diagnostic applications. It is the interface between the microcontroller and the special K and L lines of the ISO diagnostic port. The MC33199 has been designed to meet the Diagnosis System ISO9141 specification. This product description will detail the functionality of the device (see Figure 2, 33199 Simplified Internal Block Diagram). First, the power supply and reference voltage generator will be discussed, then the paths functions between MCU, K and L lines will be detailed. A dedicated paragraph will tell about the special functionality of the I1 pin, which allow high Baud rates transmission.
FUNCTIONAL PIN DESCRIPTION VCC (VCC)
5V typical power supply pin. Typical supply current is less than 1.5mA. circuit to VBAT (VS). When turning ON (TXD low), this pin will pull the Bus line to Gnd, the current into DIA will be internally limited to 60mA typ. The internal power transistor has a thermal shutdown circuit, which forces the DIA output OFF in case of over temperature. DIA is also the C1 comparator input. It is protected against both positive and negative over voltage by a 38V zener diode. This pin exhibits a constant input current of 7.5?A.
REF-IN-L (REF-IN-L)
Input reference for C2 comparator. This input can be connected directly to REF-OUT, with or without a resistor network, or to an external reference.
REF-IN-K (REF-IN-K)
Input reference for C1 comparator. This input can be connected directly to REF-OUT, with or without a resistor network, or to an external reference.
GND (GND)
Gnd reference for the entire device.
I1 (I1) LO (LO)
Output of C2 comparator, normally connected to a microcontroller I/O. If L input > (REF-IN-L + Hyst/2) then output LO is in high state. If L< (REF-IN-L - Hyst/2) then output LO is in low state, output transistor ON. This pin is an open collector structure. A Pull up resistor should be added to VCC. Drive capability of this output is 5mA. Bus source current pin. It is normally tied to DIA pin and to the Bus line. At static HIGH or LOW level Txd, the current source I1 delivers a current of 3mA (typ). Only during LOW to HIGH transition, does this current increase to a higher value in order to charge the key line capacitor (Cl<4nF) in a short time (see fig 3 and 4).
L (L)
Input for C2 comparator. This pin is protected against both positive and negative over voltage by a 38V zener diode. This L line is a second independent input. It can be used for wake up sequence in ISO diagnosis or as an additional input bus line. This pin exhibits a constant input current of 7.5.
RXD (RXD)
Receive output, normally connected to a microcontroller I/ O. If DIA input > (REF-IN-L + Hyst/2) then output LO is in high state. If DIA < (REF-IN-L - Hyst/2) then output LO is in low state, output transistor ON. This pin has an internal pull up resistor to VCC (2Kohm typ). Drive capability of this output is 5mA
VS (VS)
12V typical, or Vbat supply pin for the device. This pin is protected against over voltage transients.
TXD (TXD)
Transmission input, is normally connected to a microcontroller I/O.This pin controls DIA output. If Txd is high, the output DIA transistor is OFF. If Txd is low the DIA output transistor is ON.
REF-OUT (REF-OUT)
Internal reference voltage generator output pin. Its value depends on Vs (Vbat) values. This output can be directly connected to REF-IN L and REF-IN-K, or through a resistor network. Maximum current capability is 50.
DIA (DIA)
Input / Output Diagnosis Bus line pin. This pin is an open collector structure, protected against over current and short
33199
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Analog Integrated Circuit Device Data Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL DEVICE OPERATION
POWER SUPPLIES AND REFERENCE VOLTAGE
The device has two power supplies : A 5V supply, VCC, normally connected to the MCU supply voltage. This pin sinks typically 1mA during operation. A VBAT supply voltage, VS, normally tied to the car battery voltage. This pin can sustain up to 40V DC. Care should be taken for reverse battery protection and transient voltages higher than 40V. The voltage reference generator is supplied from both VCC and VBAT. It provides reference voltage for the K and L lines comparators thresholds. The reference voltage is dependant on VBAT voltage : it is linear versus VBAT voltage, for VBAT from 5.6V to 18V. Below 5.6V and over 18V the reference voltage is clamped (see Figure 12). The reference is connected externally to the device, through REFOUT pin. It is available for other needs. It can supplied 50 max (see Figure 13).
connected to L pin. The output of the comparator is available on LO output pin, which is an open collector structure. LO is normally connected to a MCU I/O port. The DIA, and L pins can sustain up to 38V DC. Care should be taken for reverse battery protection and transient voltages higher than 38V. The DIA and L pins both have internal pull down current source of typically 7.5 (see Figure 15). So the L line exhibits a 10 pull down current. The DIA pin has the same behavior when it is in OFF state, that is when TXD is at logic high level.
SPECIAL FUNCTIONALITY OF I1 PIN
The MC33199 has a unique feature which allows the transmission Baud rate to be up to 200kBaud. In practice, the K line can be several meters long, and thus can have a large parasitic capacitor value. This parasitic capacitor value will slow down the low to high transition of the K line, and indeed will limit the Baud rate transmission. For the K line to go from low to high level, the parasitic capacitor need to be charged, and it can only be charged by the pull up resistor. A low pull up resistor value would result in fast charge time of the capacitor, but also in large output current, and large power dissipation in the driver. To avoid this problem, the MC33199 incorporates a dynamic current source, which is temporary activated at the low to high transition of the TXD pin, that is when the DIA pin or K line should switch from low to high level (see Figure 6 & Figure 7). This current source is available at I1 pin. It has a typical value of 80mA. It is activated for 4s (see Figure 22 & Figure 23) and is automatically disabled after this time. During that time it will charge the K line parasitic capacitor. This extra current will quickly rise the K line voltage up to the Vbat, and will result in reduce rise time on the K line. With this feature the MC33199 can ensure Baud rate transmission of up to 200kBaud. During high to low transition on the K line, the parasitic capacitor of the bus line will be discharged by the output transistor of the DIA pin. In this case, the total current may exceed the internal current limitation of the DIA pin. If so, the current limitation will act, and discharge current will be limited to typically 60mA (See Figure 7 & Figure 17). If a high Baud rate is necessary, the I1 pin need to be connected to the DIA as shown in the typical application Figure 24. The I1 pin can also be left open, if the I1 functionality and high Baud rate are not suited in the application.
PATH FUNCTIONS BETWEEN MCU, K AND L LINES
The path function from the MCU to the K line is composed of a driver interfacing directly with the MCU through the TXD pin. The TXD pin is CMOS compatible. This driver controls a power transistor which can be turned ON or OFF. When it is ON, it pull the DIA pin low. This pin is known as K line in the ISO 9141 specification. The DIA pin structure is open collector, without pull up component. This allow the connection of several MC33199 on the K line and the use of a single pull up resistor per system (see Figure 25). In order to protect the DIA pin against short circuits to VBAT, the device incorporates a current limitation (see Figure 17) and a thermal shutdown. This current limitation will also act when the device drives a K line bus exhibiting large parasitic capacitor value (see Special functionality of I1 pin). The path from this DIA pin, or K line, to the MCU is done through a comparator. The comparator threshold voltage is connected to REF-IN-K pin. It can be tied to the REF-OUT voltage, if the VBAT dependant threshold is to be achieved. The second input of this comparator is internally connected to DIA pin. The output of the comparator is available on RXD output pin, normally connected to a MCU I/O port. RXD pin has a 2kOhms internal pull up resistor. The path from the L line, used during wake-up sequence of the transmission, to the MCU is done through a second comparator. The comparator threshold voltage is connected to REF-IN-L pin. As the REF-IN-K pin, it can be tied to the REFOUT voltage, if the VBAT dependant threshold need to be achieved. The second input of this comparator is internally
33199
Analog Integrated Circuit Device Data Freescale Semiconductor
13
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
+VBAT VCC : 5V
VS
REF-OUT LO
Reference Generator C2 + -
Protection L L Line
REF-IN-L REF-IN-K RXD Vcc C1 + Thermal Shutdown TXD Driver Current Limit GND DIA K Line RxD I 1 source I 1 RPU TxD
MCU
CAR ELECTRONIC CONTROL UNIT
Figure 24. Logic Diagram and Application Schematic
SERVICE TESTER or End of Line manufacturer programmation or checking system
33199
14
Analog Integrated Circuit Device Data Freescale Semiconductor
TYPICAL APPLICATIONS
+Vbat
RPU L Line K Line MCU MC33199
E.C.U # 1
SERVICE TESTER or End of Line manufacturer programmation or checking system
CAR ISO DIAGNOSTIC CONNECTOR MCU MC33199
E.C.U # 2
CAR
Other ECUs
Fig 6 : Typical application with several ECUs
Figure 25. Typical Application with Several ECUs
+12V
D2 100nF VBAT I1 L DIA GND 2x330pF
D1
Schaffner Generator 2x1nF
Figure 26. Test Circuit for Transient Schaffner Pulses Test pulses are directly applied to VS and via a capacitor of 1nF to DIA and L. The voltage VS is limited to -2V/38V by the transient suppressor diode D1. Pulses can occor simultaneously or separately.
33199
Analog Integrated Circuit Device Data Freescale Semiconductor
15
PACKAGING PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the "98A" listed below.
D SUFFIX EF-SUFFIX (PB-FREE) PLASTIC PACKAGE 98ASB42565B ISSUE H
33199
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Analog Integrated Circuit Device Data Freescale Semiconductor
REVISION HISTORY
REVISION HISTORY
Revision 2.0
Date 8/2006
Description of Changes * * * * * * * Implemented Revision History page Added EF Pb-FREE suffix Revised Figure 1, Simplified Application Drawing. Converted to Freescale format and updated to the prevailing form and style Removed MC33199EF/R2 and replaced with MCZ33199EF/R2 in the Ordering Information block Made unit label corrections on Transmission Speed, High or Low Bit Time, LO Output :, and I1 Output @ VS-I1 > 2.7V : on page 7. Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page 4. Added note with instructions to obtain this information from www.freescale.com.
3.0 4.0
9/2006 10/2006
33199
Analog Integrated Circuit Device Data Freescale Semiconductor
17
How to Reach Us:
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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc., 2006. All rights reserved.
MC33199 Rev. 4.0 10/2006


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